● Minimal resin flow, flexible and less resin dust
● High peel strength, and flammability UL94 V-0

● Excellent thermal reliability and electrical properties

● Excellent mechanical processability, punching process applicable

Application Area

● Suitable for bonding used in die cavity board and multilayer rigid-flex PCB application
  • Product Performance
  • Product Certificate
  • Data Download
Items Method Condition Unit Typical Value
Tg 2.4.25D DSC

Td 5% wt. loss 315
T288 TMA min 3
TMA min
Thermal Stress
288℃, solder dip
- after 6 cycles, no delamination
Volume Resistivity C-96/35/90 MΩ/cm 5.0 x 108
Surface Resistivity
C-96/35/90 5.0 x 107
Peel Strength (1Oz) 2.4.8 288℃/10s N/mm 2.0
Water Absorption D-24/23 % 0.15


1. All the typical values listed above are for your reference only. Please turn to Shengyi Technology Co., Ltd. for more detailed information, and all rights from this datasheet are reserved by Shengyi Technology Co., Ltd.

2. Explanation:C=Humidity conditioning, D=Immersion conditioning in distilled water, E=Temperature conditioning

The first digit following the letter indicates the duration of preconditioning in hours, the second digit the preconditioning temperature in and the third digit the relative humidity.

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