● High peel strength and Flammability UL94 V-0

● Excellent thermal reliability and electrical properties

● Excellent processability, punching process applicable

● Excellent flexibility performance in rigid CCL

Application Area

● Suitable for communication and Auto production with semi-flex performance
  • Product Performance
  • Product Certificate
  • Data Download
Items Method Condition Unit Typical Value
Tg 2.4.25D DSC

Td 5% wt. loss 315
T288 TMA min 3
TMA min
Thermal Stress
288℃, solder dip
- after 6 cycles, no delamination
Volume Resistivity C-96/35/90 MΩ/cm 5.0 x 108
Surface Resistivity
C-96/35/90 5.0 x 107
Peel Strength (1oz) 2.4.8 288℃/10s N/mm 2.0
Water Absorption D-24/23 % 0.15


1. All he typical values listed above are for your reference only. Please turn to Shengyi Technology Co., Ltd. for more detailed information, and all rights from this data sheet are reserved by Shengyi Technology Co., Ltd.

2. Explanation:C=Humidity conditioning, D=Immersion conditioning in distilled water, E=Temperature conditioning

The first digit following the letter indicates the duration of preconditioning in hours, the second digit the preconditioning temperature in and the third digit the relative humidity.

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