● Polyimide system provides ultra-high thermal performance, with Tg>250℃ (TMA), Td>405℃ (5% loss, TGA), and T300>60min.
● Lower Z-axis CTE of 1.20% (50-260℃) offering superior PTH reliability.
● Maintain mechanical strength and bonding strength at high temperature.
● Tough resin system, Non-MDA chemistry.
● Halogen-free chemistry compatible with lead-free processing. RoHS/WEEE compliant.
● IPC 4101D/40,/41.

Application Area

● Burn-in Board

● Down Hole

● Aircraft and Aerospace

● Other PCB requirements to work under high temperature in long time

  • Product Performance
  • Product Certificate
  • Data Download

Items Method Condition Unit Typical Value
Tg DMA >250
Td 5% wt. loss 429
TMA min
CTE(X/Y-axis) 2.4.24 50-260℃ (X/Y) ppm/℃ 12~15
CTE(Z-axis) 2.4.24 α1 (before Tg) ppm/℃ 45
50-260℃ % 1.20
Dissipation Constant (1GHz) C-24/23/50 - 4.12
Dissipation Factor (1GHz)
- 0.007
Volume Resistivity C-96/35/90 MΩ/cm 7.45 x 107
Surface Resistivity
C-96/35/90 4.79 x 107
Arc Resistance 2.5.1 D-48/50+D-0.5/23 kV 180
Electrical Strength D-48/50+D-0.5/23 kV 85
Dielectric Breakdown 2.5.6 D-48/50+D-0.5/23 kV 40.5
Peel Strength 2.4.8 288℃/10s N/mm 1.37 [7.82]
Young's Modulus 200℃ GPa - 10.3
Flexural Strength 2.4.4 A MPa 530 [76,850]

439 [63,655]

Water Absorption D-24/23 % 0.26


1. Specimen thickness: 1.6mm (Electrical Strength and Young's Modulus Specimen thickness 0.1mm). Test method is according to IPC-TM-650.

2. All the typical values listed above are for your reference only. Please turn to Shengyi Technology Co., Ltd. for more detailed information, and all rights from this data sheet are reserved by Shengyi Technology Co., Ltd.

3. Explanation:C=Humidity conditioning, D=Immersion conditioning in distilled water, E=Temperature conditioning.

The figures following the letter symbols indicate with the first digit the duration of the preconditioning in hours, with the second digit the preconditioning temperature in ℃ and the third digit the relative humidity.